S.D. Pozder: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits

Jain, A., Jones, R.E., Chatterjee, R., Pozder, S.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 645 KB

english, 2010

2

Analysis of flip-chip packaging challenges on copper/low-k interconnects

Mercado, L.L., Goldberg, C., Shun-Meen Kuo,, Tien-Yu Lee,, Pozder, S.K.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 1.55 MB

english, 2003

3

[IEEE 2007 IEEE International Conference on Integrated Circuit Design and Technology - Austin, TX, USA (2007.05.30-2007.06.1)] 2007 IEEE International Conference on Integrated Circuit Design and Technology - Technology and Application of 3D Interconnect

Jones, Robert E., Chatterjee, Ritwik, Pozder, Scott

Year:

2007

Language:

english

File:

PDF, 2.50 MB

english, 2007

4

[AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: Tenth International Workshop on Stress-Induced Phenomena in Metallization - Austin (Texas) (5–7 November 2008)] AIP Conference Proceedings - Reliability Considerations in 3D Stacked Strata Systems

Pozder, Scott, Jain, Ankur, Jones, Robert, Huang, Zhihong, Justison, Patrick, Chatterjee, Ritwik, Ho, Paul S., Zschech, Ehrenfried, Ogawa, Shinichi

Year:

2009

Language:

english

File:

PDF, 5.45 MB

english, 2009

5

[IEEE 2017 IEEE International Integrated Reliability Workshop (IIRW) - Fallen Leaf Lake, CA (2017.10.8-2017.10.12)] 2017 IEEE International Integrated Reliability Workshop (IIRW) - Product reliability and qualifications for high consequence/low volume integrated circuits: Discussion group, Oct. 10, 2017

Haase, Gaddi, Yang-Scharlotta, Jean, Siddiqui, Jeff, LaRow, Charles, Pozder, Scott, Paliwoda, Peter, Hogan, Matthew, May, James

Year:

2017

Language:

english

File:

PDF, 132 KB

english, 2017

6

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Utilizing Thermo-Mechanical CPI Simulation to Define a 7nm Package Envelope

Raman, Thiagarajan, Pozder, Scott, Graas, Carole, Kamineni, Himani Suhag

Year:

2018

Language:

english

File:

PDF, 368 KB

english, 2018

7

Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits

Ioannis Savidis, Syed M. Alam, Ankur Jain, Scott Pozder, Robert E. Jones, Ritwik Chatterjee

Journal:

Microelectronics Journal

Year:

2010

Language:

english

File:

PDF, 541 KB

english, 2010

8

Crystal structure of molybdenum nitride films made by reactive cathodic arc evaporation

A.J. Perry, A.W. Baouchi, J.H. Petersen, S.D. Pozder

Journal:

Surface and Coatings Technology

Year:

1992

Language:

english

File:

PDF, 448 KB

english, 1992

9

Mechanical integrity evaluation of low-k device with bump shear

Peng Su, Jie-Hua Zhao, Scott Pozder, David Wontor

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 369 KB

english, 2006

10

Thermal-electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints

Jain, A., Alam, S.M., Pozder, S., Jones, R.E.

Journal:

IET Computers & Digital Techniques

Year:

2011

Language:

english

File:

PDF, 990 KB

english, 2011

11

Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration

Alam, S.M., Jones, R.E., Pozder, S., Chatterjee, R., Rauf, S., Jain, A.

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Year:

2010

Language:

english

File:

PDF, 1.61 MB

english, 2010

12

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermal modeling and design of 3D integrated circuits

Jain, Ankur, Jones, Robert E., Ritwik Chatterjee,, Pozder, Scott, Zhihong Huang,

Year:

2008

Language:

english

File:

PDF, 265 KB

english, 2008

13

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Nanoscale conformable coatings for enhanced thermal conduction of carbon nanotube films

Marconnet, Amy M., Motoyama, Munekazu, Barako, Michael T., Yuan Gao,, Pozder, Scott, Fowler, Burt, Ramakrishna, Koneru, Mortland, Glenn, Asheghi, Mehdi, Goodson, Kenneth E.

Year:

2012

Language:

english

File:

PDF, 837 KB

english, 2012

14

[IEEE 1999 IEEE International SOI Conference. Proceedings - Rohnert Park, CA, USA (4-7 Oct. 1999)] 1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345) - Performance trade-offs of argon implanted SOI MOSFETs with In and Sb retrograde channel doping

Xu, X.-L., Widenhofer, R., Yu, Y., Zia, O., Pozder, S., Hall, D., Rashed, M., Chang, D., Jallepalli, S., Connelly, D., Van Gompel, T., Olivares, M., Mendicino, M., Candelaria, J., Veeraraghavan, S., D

Year:

1999

Language:

english

File:

PDF, 148 KB

english, 1999

15

[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Back-end compatibility of bonding and thinning processes for a wafer-level 3D interconnect technology platform

Pozder, S., Lu, J.-Q., Kwon, Y., Zollner, S., Yu, J., McMahon, J.J., Cale, T.S., Yu, K., Gutmann, R.J.

Year:

2004

Language:

english

File:

PDF, 248 KB

english, 2004

16

[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - Progress of 3D Integration Technologies and 3D Interconnects

Pozder, Scott, Chatterjee, Ritwik, Jain, Ankur, Huang, Zhihong, Jones, Robert E., Acosta, Eddie

Year:

2007

Language:

english

File:

PDF, 225 KB

english, 2007

17

[IEEE 1998 Symposium on VLSI Technology Digest of Technical Papers - Honolulu, HI, USA (9-11 June 1998)] 1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) - Benefits of SiF/sub 3//sup +/ implanted titanium silicides in advanced CMOS fabrication

Wang, L.Z., Tseng, H.-H., Pozder, S.

Year:

1998

Language:

english

File:

PDF, 259 KB

english, 1998

18

[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - Three dimensional chip stacking using a wafer-to-wafer integration

Chatterjee, Ritwik, Fayolle, Murielle, Leduc, Patrick, Pozder, Scott, Jones, Bob, Acosta, Eddie, Charlet, Barbara, Enot, Thierry, Heitzmann, Michel, Zussy, Marc, Roman, Antonio, Louveau, Olivier, Mait

Year:

2007

Language:

english

File:

PDF, 198 KB

english, 2007

19

[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - 3D Die-to-wafer Cu/Sn Microconnects Formed Simultaneously with an Adhesive Dielectric Bond Using Thermal Compression Bonding

Pozder, Scott, Jain, Ankur, Chatterjee, Ritwik, Huang, Zhihong, Jones, Robert E., Acosta, Eddie, Marlin, Bill, Hillmann, Gerhard, Sobczak, Martin, Kreindl, Gerald, Kanagavel, Senthil, Kostner, Hannes,

Year:

2008

Language:

english

File:

PDF, 421 KB

english, 2008

20

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Electromigration of Cu-Sn-Cu micropads in 3D interconnect

Zhihong Huang,, Chatterjee, Ritwik, Justison, Patrick, Hernandez, Richard, Pozder, Scott, Jain, Ankur, Acosta, Eddie, Gajewski, Donald A., Mathew, Varughese, Jones, Robert E.

Year:

2008

Language:

english

File:

PDF, 1.82 MB

english, 2008

21

[IEEE IEEE 2005 International Interconnect Technology Conference - Burlingame, CA, USA (6-8 June 2005)] Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - Integration of a mechanically reliable 65-nm node technology for low-k and ULK interconnects with various substrate and package types

Goldberg, C., Downey, S., Fiori, V., Fox, R., Hess, K., Hinsinger, O., Humbert, A., Jacquemin, J.-P., Lee, S., Lhuillier, J.-B., Orain, S., Pozder, S., Proenca, L., Quercia, F., Sabouret, E., Tu Anh T

Year:

2005

Language:

english

File:

PDF, 620 KB

english, 2005

22

Observation of interfacial void formation in bonded copper layers

Tan, C. S., Reif, R., Theodore, N. D., Pozder, S.

Journal:

Applied Physics Letters

Year:

2005

Language:

english

File:

PDF, 454 KB

english, 2005

23

[IEEE 2009 10th International Symposium on Quality of Electronic Design (ISQED) - San Jose, CA, USA (2009.03.16-2009.03.18)] 2009 10th International Symposium on Quality of Electronic Design - Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology

Alam, Syed M., Jones, Robert E., Pozder, Scott, Jain, Ankur

Year:

2009

Language:

english

File:

PDF, 432 KB

english, 2009

24

Electroforming and resistive switching in silicon dioxide resistive memory devices

Fowler, Burt W., Chang, Yao-Feng, Zhou, Fei, Wang, Yanzhen, Chen, Pai-Yu, Xue, Fei, Chen, Yen-Ting, Bringhurst, Brad, Pozder, Scott, Lee, Jack C.

Journal:

Year:

2015

Language:

english

File:

PDF, 2.85 MB

english, 2015

25

Exploration of the Scaling Limits of 3D Integration

Pozder, Scott, Jones, Robert, Adams, Vance, Li, Hui-Feng, Canonico, Michael, Zollner, Stefan, Lee, Sang Hwui, Gutmann, Ronald J., Lu, Jian-Qiang

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 209 KB

english, 2006

26

Development and field validation of a Mycoplasma iowae real-time polymerase chain reaction assay

Cai, H. Y., Bell-Rogers, P., Parker, L., Ferencz, A., Pozder, P.

Journal:

Journal of Veterinary Diagnostic Investigation

Year:

2008

Language:

english

File:

PDF, 643 KB

english, 2008

27

[AIP PHYSICS OF SEMICONDUCTORS: 27th International Conference on the Physics of Semiconductors - ICPS-27 - Flagstaff, Arizona (USA) (26-30 July 2004)] AIP Conference Proceedings - Raman and XRD Strain Analysis of 3D Bonded And Thinned SOI Wafers

Year:

2005

Language:

english

File:

PDF, 203 KB

english, 2005

28

Management of prehospital shoulder dislocation: feasibility and need of reduction

Helfen, T., Ockert, B., Pozder, P., Regauer, M., Haasters, F.

Journal:

European Journal of Trauma and Emergency Surgery

Year:

2016

Language:

english

File:

PDF, 653 KB

english, 2016

29

[IEEE 1994 IEEE 1st World Conference on Photovoltaic Energy Conversion - WCPEC (A Joint Conference of PVSC, PVSEC and PSEC) - Waikoloa, HI, USA (5-9 Dec. 1994)] Proceedings of 1994 IEEE 1st World Conference on Photovoltaic Energy Conversion - WCPEC (A Joint Conference of PVSC, PVSEC and PSEC) - Polycrystalline thin film CdTe solar cells fabricated by electrodeposition

Donghwan Kim,, Pozder, S., Zhu, Y., Trefny, J.U.

Year:

1994

Language:

english

File:

PDF, 442 KB

english, 1994

30

Study of Cobalt Salicide Fabrication on Sub-Quarter Micron Polysilicon Lines

Chen, Wei-Ming, Pozder, Scott, Limb, Young, Sitaram, A R, Fiordalice, Bob

Journal:

MRS Proceedings

Year:

1996

Language:

english

File:

PDF, 1.43 MB

english, 1996

31

[AIP The 12th NREL photovoltaic program review - Denver, Colorado (USA) (13−15 Oct 1993)] AIP Conference Proceedings - Thin film CdS/CdTe solar cells fabricated by electrodeposition

Kim, D., Pozder, S., Qi, B., Zhu, Y., Furtak, T. E., Williamson, D. L., Trefny, J. U.

Year:

1994

Language:

english

File:

PDF, 1.09 MB

english, 1994

32

[IEEE 2017 IEEE International Integrated Reliability Workshop (IIRW) - Fallen Leaf Lake, CA (2017.10.8-2017.10.12)] 2017 IEEE International Integrated Reliability Workshop (IIRW) - Package reliability: How can we use ideas/methods from semiconductor reliability in package reliability?

Kopley, Tom, Pozder, Scott, Anselm, Martin, Justison, Patrick, Ring, Matt, Beckmann, Karsten, Siddiqui, Jeff, Haase, Gaddi

Year:

2017

Language:

english

File:

PDF, 71 KB

english, 2017

33

[IEEE 2018 IEEE International Interconnect Technology Conference (IITC) - Santa Clara, CA, USA (2018.6.4-2018.6.7)] 2018 IEEE International Interconnect Technology Conference (IITC) - BEoL Layout Design Considerations to Mitigate CPI Risk

Rabie, Mohamed A., Raman, Thiagarajan, Mirza, Fahad, Polomoff, Nicholas A., Faruqui, Danish, Pozder, Scott, Hassan, Md Khaled, Desouky, Tamer, Graas, Carole

Year:

2018

Language:

english

File:

PDF, 1.85 MB

english, 2018

34

The first nationwide multicenter study of Acinetobacter baumannii recovered in Serbia: emergence of OXA-72, OXA-23 and NDM-1-producing isolates

Lukovic, Bojana, Gajic, Ina, Dimkic, Ivica, Kekic, Dusan, Zornic, Sanja, Pozder, Tatjana, Radisavljevic, Svetlana, Opavski, NataÅ¡a, Kojic, Milan, Ranin, Lazar

Journal:

Antimicrobial Resistance and Infection Control

Year:

2020

File:

PDF, 2.35 MB

2020

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски